Illuminating device and projector device

ABSTRACT

A projector module adopts a structure having an optical image forming block and an optical block integrated via a locking member. The optical image forming block adopts a structure achieved by disposing an aluminum substrate at which an LED is mounted and a liquid crystal panel in a casing constituted with a plastic material having low thermal conductivity. The locking member is formed by bending a metal sheet through a sheet metal bending process and the locking member is set in surface contact with the substrate. The optical block adopts a structure achieved by disposing a PBS and a reflecting member at the casing constituted with a plastic material having low thermal conductivity with a quarter-wave plate disposed at the boundary of the two members.

INCORPORATION BY REFERENCE

The disclosures of the following priority applications are hereinincorporated by reference:

Japanese Patent Application No. 2004-258466 filed Sep. 6, 2004

Japanese Patent Application No. 2004-365883 filed Dec. 17, 2004

Japanese Patent Application No. 2005-037335 filed Feb. 15, 2005

Japanese Patent Application No. 2005-063948 filed Mar. 8, 2005

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an illuminating device and a projectordevice that use a light emitting element as a light source.

2. Description of Related Art

Japanese Laid Open Patent Publication No. 2000-194275 discloses an imagedisplay device (projector) having a liquid crystal display (LCD)constituted with a liquid crystal panel or the like and a light sourcefor illuminating the LCD, which projects an image formed with light(modulated light) having been transmitted through the LCD. An LED with ahigh level of brightness is used as the light source in this device. Thedevice can be provided as a more compact unit since it employs an LEDrather than a halogen lamp or a xenon lamp. It also achieves anadvantage in that on/off control of the light source is facilitated.However, it is necessary to supply a large electrical current to the LEDin order to increase the brightness with which light is emitted at theLED, and unless appropriate measures are taken against the heatgenerated at the LED, the LED may become damaged by its own heat.

SUMMARY OF THE INVENTION

A projector device to be mounted in an electronic apparatus according toa first aspect of the present invention includes a first memberconstituted of a thermally conductive material, at which a lightemitting device is disposed; a light modulating member that modulateslight originating from the light emitting device; a projection opticalsystem that projects an image formed with the light modulated by thelight modulating member; a second member constituted of a material witha lower level of thermal conductivity compared to the first member, atwhich the first member and the light modulating member are disposed; anda third member constituted of a material with a high level of thermalconductivity compared to the second member, that supports the secondmember and the projection optical system as an integrated unit and comesinto surface contact with the first member.

In the projector device to be mounted in an electronic apparatusaccording to the first aspect, it is preferable that the second memberis formed in a prismatic shape so as to enclose a passing light flux;and the third member is bent so as to fit along an outer surface of theprism-shaped second member. Te first member may be disposed at aposition of a bottom surface of the prism-shaped second member; and thethird member may come into surface contact with the first member at theposition of the bottom surface.

In the projector device to be mounted in an electronic apparatusaccording to the first aspect, it is preferable that the second memberhold the light modulating member at a position away from the thirdmember, and the third member should include a mounting portion to beused to mount the projector device in the electronic apparatus. Aseparating portion disposed at the second member, that separates a spacetoward the first member from a space toward the light modulating membermay further be provided.

An illuminating device to be mounted into an electronic apparatus, thatdirects light generated at a light emitting device to an outsideaccording to a second aspect of the present invention includes a metalsubstrate that comprises a mounting surface at which the light emittingdevice is mounted; and a metal heat transfer block that comes intosurface contact with a rear side of the mounting surface correspondingto a mounting position of the light emitting device, and a sum of athickness of the metal substrate and a length of the heat transfer blockalong a direction perpendicular to the mounting surface is greater thana distance from the mounting position of the light emitting device to anend of the mounting surface.

In the illuminating device according to the second aspect, the metalsubstrate and the heat transfer block may come into surface contact viaa thermally conductive member.

An illuminating device to be mounted into an electronic apparatus, thatdirects light generated at a light emitting device to an outsideaccording to a third aspect of the present invention includes a metalheat transfer block that comprises amounting surface at which the lightemitting device is mounted, and a length of the heat transfer blockalong a direction perpendicular to the mounting surface is greater thana distance from a mounting position of the light emitting device to anend of the mounting surface.

In the illuminating device according to the second or third aspect, itis preferable that the heat transfer block include as an integrated partthereof one of a positioning portion used to determine a position of theilluminating device relative to the electronic apparatus and a mountingportion used to mount the illuminating device in the electronicapparatus.

The illuminating device according to the second or third aspect mayfurther include an image forming unit that receives the light from thelight emitting device and forms projection light for image projection;and a projection unit that projects the projection light formed at theimage forming unit to the outside. It is preferable that an integratedunit be constituted by stacking the heat transfer block, the lightemitting device, the image forming unit and the projection unit along asingle direction and an optical axis of the projection light run along adirection perpendicular to the single direction.

An illuminating device that emits light generated at a light emittingdevice according to a forth aspect of the present invention includes ametal mounting substrate at which the light emitting device is mounted;and a casing in which the mounting substrate having the light emittingdevice mounted there at is housed, and the mounting substrate isdisposed at a metal portion of the casing so as to release heatgenerated at the light emitting device to an outside via the mountingsubstrate and the casing.

In the illuminating device according to the forth aspect, it ispreferable that a rear side of the mounting substrate at which the lightemitting device be mounted is set incomplete contact with the metalportion of the casing either directly or via a thermally conductivemember. It is preferable that the metal portion coming into completecontact with the mounting substrate be a bottom portion of the casing;and the illuminating device further include a light path altering memberdisposed inside the casing, that bends the light radiated upward fromthe light emitting device and directs the bent light to the outsidealong a substantially horizontal direction.

An illuminating device that emits light generated at a light emittingdevice according to a fifth aspect of the present invention includes acasing that houses the light emitting device and comprises a metalportion at which the light emitting device is mounted.

In the illuminating device according to the fifth aspect, it ispreferable that the metal portion at which the light emitting device ismounted be a bottom portion of the casing; and the illuminating devicefurther include a light path altering member disposed inside the casing,that bends the light radiated upward from the light emitting device anddirects the bent light to an outside along a substantially horizontaldirection.

The illuminating device according to the forth or fifth aspect, mayfurther include an image forming unit that receives the light from thelight emitting device and forms projection light for image projection;and a projection optical system that projects the projection lightformed at the image forming unit to the outside along a substantiallyhorizontal direction via the light path altering member. Theilluminating device according to the forth or fifth aspect may furtherinclude heat radiating fins formed at an outer surface of the casing ata position corresponding to the light emitting device.

An illuminating device that emits light generated at a light emittingdevice according to a sixth aspect includes a metal mounting substrateto be positioned substantially parallel to an installation surface atwhich the illuminating device is installed, with the light emittingdevice mounted on an upper surface of the metal mounting substrate; anda casing that covers the mounting substrate so as to expose part of alower surface facing opposite the installation surface.

In the illuminating device according to the sixth aspect, it ispreferable that the casing forms a gap between the mounting substrateand the installation surface. The casing may allow the gap between themounting substrate and the installation surface to be varied.Alternatively, the casing may allow an angle formed by the mountingsubstrate and installation surface to be varied.

A projector device according to a seventh aspect of the presentinvention includes an illuminating device according to the sixth aspect;an optical image forming device that forms an optical image bymodulating the light from the illuminating device; a light path alteringmember that alters a light path; and a projection optical system thatprojects the optical image formed by the optical image forming device.

According to the first through seventh aspect, the light emitting deviceis an LED.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B present external views of a portable telephone equippedwith a projector achieved in a first embodiment of the presentinvention, with FIG. 1A presenting a side elevation and FIG. 1Bpresenting a front view;

FIGS. 2A through 2C present three views of a projector module, with FIG.2A presenting a front view, FIG. 2B presenting a side elevation and FIG.2C presenting a bottom view;

FIG. 3 is a sectional view of the projector module;

FIGS. 4A through 4E present five views of the projector module achievedin a second embodiment, with FIG. 4A presenting a rear view, FIG. 4Bpresenting a bottom view, FIG. 4C presenting a left side elevation, FIG.4D presenting a front view and FIG. 4E presenting a right sideelevation;

FIG. 5 is a sectional view of the projector module;

FIGS. 6A and 6B show an internal arrangement of a projector device, withFIG. 6A presenting a plan view and FIG. 6B presenting a side elevation;

FIG. 7 illustrates the projector module achieved in a third embodiment,fitted into a casing of an electronic apparatus;

FIG. 8 is a sectional view taken along line II-II in FIG. 7;

FIG. 9 illustrates the height that should be achieved by a metal block;

FIG. 10 shows three patterns of temperature change relative to thelength of time over which an LED remains on, representing an example ofthe results of tests conducted by the inventors of the presentinvention;

FIG. 11 presents an example in which the metal block is fixed onto anLED substrate via a thermally conductive bonding member;

FIG. 12 presents an example in which fins are formed over the lowerportion of the metal block;

FIG. 13 presents an example in which the lower surface of the metalblock is formed in a circular arc-shape;

FIG. 14 presents an example in which a positioning boss is disposed atthe side surface of the metal block;

FIG. 15 presents an example in which a screw through hole is formed atthe metal block;

FIG. 16 presents an example in which a fitting portion is formed at themetal block;

FIG. 17 presents an example in which a fitting hole is formed at themetal block;

FIG. 18 presents an example in which the LED is directly mounted at themetal block;

FIG. 19 is a front view of the projector achieved in a fourthembodiment;

FIG. 20 is a sectional view taken along line II-II in FIG. 19;

FIG. 21 is a front view of the projector achieved in a fifth embodiment;

FIG. 22 is a sectional view taken along line IV-IV in FIG. 21;

FIG. 23 is a front view of a liquid crystal projector achieved in asixth embodiment of the present invention;

FIG. 24 is a sectional view of FIG. 23;

FIG. 25 is a sectional view of the liquid crystal projector achieved ina seventh embodiment;

FIG. 26 is a sectional view of the liquid crystal projector achieved inthe seventh embodiment;

FIG. 27 is a front view of the liquid crystal projector achieved in aneighth embodiment; and

FIG. 28 is a sectional view of FIG. 27.

DESCRIPTION OF PREFERRED EMBODIMENTS First Embodiment

The following is an explanation of a projector device achieved in thefirst embodiment of the present invention, given in reference todrawings. In the first embodiment, a projector device is mounted at aportable telephone which is an electronic apparatus.

FIGS. 1A and 1B present external views of a handheld-type portabletelephone equipped with a projector, achieved in the first embodiment ofthe present invention, with FIG. 1A presenting a side elevation and FIG.1B presenting a front view. The portable telephone 10 includes anantenna 11, a liquid crystal display 12, an operating member 13 whichincludes a dial button and the like, ventilating holes 14 and aprojector projecting port 20. The portable telephone 10 is used toexchange e-mail, data and the like as well as to make/receive atelephone call to/from another telephone via a base station (not shown).In addition, it is equipped with a projector device to be detailedlater, which projects an image, a received e-mail or the like displayedat the liquid crystal display 12 toward a wall or the like through theprojector projecting port 20. The projector device in the firstembodiment is constituted with a projector module.

Since the first embodiment is characterized by the structure of theprojector module mounted at the portable telephone 10, the followingexplanation focuses on the projector module.

FIGS. 2A through 2C present three views of the projector module PJ, withFIG. 2A presenting a front view, FIG. 2B presenting a side elevation andFIG. 2C presenting a bottom view. The projector module PJ comprises anoptical block 40 (projection optical system) and an optical imageforming block 30, which are integrated via a locking member 25 (thirdmember) The locking member 25 may be formed by bending a metal sheetsuch as an aluminum plate through a sheet metal bending process. Thelocking member 25 includes mounting portions 25A and 25B each havingformed therein a threaded retaining hole, and the projector module PJ islocked inside a casing of the portable telephone 10. The mountingportions 25A and 25B function as mounting margins.

FIG. 3 is a sectional view taken along G-G′ in FIG. 2B. The opticalimage forming block 30 is constituted by disposing a substrate 21B(first member) in an optical image forming block casing 26 (secondmember). The casing 26 is formed by using a material such as plasticwith low thermal conductivity. The substrate 21B is an aluminumsubstrate, and a white-color LED 21A capable of emitting very brightlight is mounted on a pattern formed on an insulating layer present onan LED mounting surface of the substrate 21B. The LED 21A illuminates aliquid crystal panel 22 at a brightness corresponding to the level ofthe electrical current supplied thereto via a harness 21C. The liquidcrystal panel 22 is constituted by sealing liquid crystal between glassplates 22A and 22B. It is to be noted that the liquid crystal panel 22may be either a color display or a monochrome display. The LED 21Afunctions as a light emitting element or light emitting device, whereasthe liquid crystal panel 22 functions as a light valve or lightmodulating member that modulates the light originating from the lightemitting element 21A, i.e., as a light modulating member. The lightemitting element used in the embodiment may be, for instance, an organicEL or an LED.

The liquid crystal panel 22 is driven by a drive signal provided via aflexible substrate 21D to reproduce an image, text (characters) or thelike. For instance, by driving the liquid crystal panel 22 with a drivesignal similar to a display signal (drive signal) provided to the liquidcrystal display 12, an image matching the display contents at the liquidcrystal display 12 can be formed at the liquid crystal panel 22. Morespecifically, a voltage corresponding to the density at each pixel inthe image is applied to the liquid crystal layer. As such voltages areapplied to the liquid crystal layer, the arrangement of the liquidcrystal molecules changes, causing a change in the transmittance of thelight at the liquid crystal layer. By modulating the light from the LED21A in conformance to the drive signal as described above, an opticalimage is generated at the liquid crystal panel 22. The light flux havingbeen transmitted through the liquid crystal panel 22 advances upward inFIG. 3 and enters the optical block 40.

The optical block 40 includes a polarizing beam splitter (hereafterreferred to as a PBS) 23A and a reflecting member 23B disposed in anoptical block casing 24, with a quarter-wave plate 23 λ disposed at theboundary between the PBS 23A and the reflecting member 23B. The casing24 is formed by using a material such as plastic with a low level ofthermal conductivity.

The light flux having entered the optical block 40 then enters the PBS23A through the bottom side in FIG. 3, and an S polarized component inthe incident light is reflected at a polarization splitting portion 23Pto advance to the left. The reflected light flux having advanced to theleft exits the PBS 23A and is reflected at a reflected surface 23C ofthe reflecting member 23B via the quarter-wave plate 23 λ. Thereflecting light flux then reenters the PBS 23A via the quarter-waveplate 23 λ. The light flux having reentered the PBS 23A will have beenconverted to a P-polarized light component as it has passed through thequarter-wave plate 23 λ twice. Thus, it is transmitted through-thepolarization splitting portion 23P of the PBS 23 a to advance to theright.

The transmitted light flux having advanced to the right exits the PBS23A to advance to the right and is projected through the projectorprojecting port 20. As a result, the optical image formed at the liquidcrystal panel 22 is projected toward a screen or the like. It is to benoted that the reflecting surface 23C is formed as a curved surfaceachieving a specific shape so as to preclude the necessity for providinga separate projection lens.

As shown in FIGS. 2A through 2C, the locking member 25 clamps thesubstantially rectangular parallelepiped optical image forming block 30on four surfaces. Explicitly, it is conjoined with the correspondingsurfaces of the optical image forming block 30 so as to cover theoptical image forming block 30 from four directions, from the left, fromthe bottom and from the right in FIG. 2B and also from above the drawingsheet surface (along the direction perpendicular to the drawing sheetsurface). A hole 25X (see FIG. 2A) and a hole 25Y (see FIG. 2B) areformed at the surface facing front in FIG. 2A and the surface facingfront in FIG. 2B respectively among the surfaces of the locking member25 conjoined with the optical image forming block 30. These holes 25Xand 25Y are formed so as to interlock respectively with a projectingportion 26X and a projecting portion 26Y of the casing 26 of the opticalimage forming block 30 when the optical image forming block 30 is heldby the locking member 25. Thus, the locking member 25 and the opticalimage forming block 30 can be provided as an integrated unit withouthaving to use screws, an adhesive or the like.

In addition, among the surfaces of the locking member 25 conjoined withthe optical image forming block 30, the surface facing front in FIG. 2Cis formed specifically to achieve surface contact with the lower surfaceof the substrate 21B and is conjoined after a thermally conductivepacking material (such as a silicon grease) is applied thereto. Also, atthis particular surface of the locking member 25, a hole 25Z is formedso as to partially expose the substrate 21B when the optical imageforming block 30 is clamped by the locking member 25.

With the locking member 25 and the optical image forming block 30conjoined as described above, the substantially rectangularparallelepiped optical block 40 is clamped by the locking member 25 ontwo surfaces, as shown in FIGS. 2A and 2B. Namely, the locking member 25is conjoined with surfaces of the optical block 40 from the left andfrom the right in FIG. 2B. The optical block 40 is structured so thatthe optical block 40 clamped by the locking member 25 is allowed toslide freely along the locking member 25 along the optical axis Ax inFIG. 3, i.e., along the upward/downward direction in FIGS. 2A and 2B. Asthe optical block 40 slides along the upward/downward direction in FIGS.2A and 2B, the focus of the image projected by the projector module PJis adjusted. It is to be noted that the fine adjustment mechanism thatcauses the optical block 40 to slide in small increments is not includedin the illustrations presented in FIG. 2. Thus, the locking member 25and the optical block 40, as well as the locking member 25 and theoptical image forming block 30, can be provided as an integrated unitwithout having to use screws, an adhesive or the like.

When the projector module PJ formed as an integrated unit as describedabove is locked to the casing of the portable telephone 10, the exposedportion of the substrate 21B is set at a position immediately inwardrelative to the ventilating holes 14 (see FIG. 1) of the portabletelephone 10.

The following operational effects can be achieved in the firstembodiment described above.

-   (1) The projector module PJ includes the optical image forming block    30 and the optical block 40 which are integrated via the locking    member 25. The optical image forming block 30 is constituted by    disposing the aluminum substrate 21B at which the LED 21A is mounted    and the liquid crystal panel 22 at the casing 26 formed by using a    plastic material with low thermal conductivity. The casing 26 holds    the liquid crystal panel 22 at a position distanced from the locking    member 25 so as to disallow ready transfer of the heat generated at    the LED 21A to the liquid crystal panel 22. As a result, the    temperature of the liquid crystal panel 22 is not allowed to rise.-   (2) The white-color LED 21A, capable of emitting very bright light    is mounted on the metal substrate 21B with a higher thermal    conductivity than a substrate made of, e.g., a resin or plastic    material, and thus, the heat generated at the LED 21A can be quickly    transmitted to the substrate 21B. This, in turn, prevents an    increase in the temperature of the apparatus to a level exceeding    the allowable range. In particular, the quantity of heat generated    at the LED 21A increases when the LED 21A generates bright light,    and for this reason, it is critical that the heat releasing effect    be improved in order to protect the LED 21A from rising    temperatures.-   (3) The locking member 25 is formed by bending a metal sheet through    a sheet metal bending process, and the locking member 25 and the    substrate 21B are made to achieve surface contact with each other.    As a result, the heat transmitted to the substrate 21B can then be    efficiently radiated through the locking member 25.-   (4) The hole 25Z is formed so as to partially expose the substrate    21B at a surface of the locking member 25 which comes in contact    with the substrate 21B. This also allows the heat to be directly    released from the substrate 21B.-   (5) The optical block 40 is constituted by disposing the PBS 23A and    the reflecting member 23B at the casing 24 formed by using a plastic    material with a low level of thermal conductivity and then by    disposing the quarter-wave plate 23 λ at the boundary between the    PBS 23A and the reflecting member 23B. Since very little of the heat    transferred from the optical image forming block 30 to the locking    member 25 is transferred to the PBS 23A and the reflecting member    23B present inside the optical block 40, degradation in the quality    of the projected image attributable to thermal expansion can be    prevented.-   (6) The locking member 25 and the optical image forming block 30 are    integrated by clamping the substantially rectangular parallelepiped    optical image forming block 30 with the locking member 25 at four    surfaces so as to cover the optical image forming block 30 and by    causing the hole 25X (see FIG. 2A) and the hole 25Y (see FIG. 2B)    formed at two of the surfaces of the locking member 25 conjoined    with the optical image forming block 30 to interlock respectively    with the projecting portion 26X and the projecting portion 26Y    present at the casing 26 of the optical image forming block 30 when    the optical image forming block 30 is clamped by the locking member    25. Since this eliminates the need for screws, an adhesive or the    like, the assembly work efficiency improves and the locking member    25 and the optical image forming block 30 can be provided as an    integrated unit with ease. In addition, with the locking member 25    achieving a high level of thermal conductivity covering the exterior    of the optical image forming block 30, the heat releasing effect is    further improved.-   (7) The locking member 25 and the optical block 40 are integrated by    clamping the substantially rectangular parallelepiped optical block    40 with the locking member 25 on two surfaces and allowing the    clamped optical block 40 to slide along the locking member 25 along    the optical axis Ax in FIG. 3, i.e., along the upward/downward    direction in FIGS. 2A and 2B. As the optical block 40 slides, the    focus of the image projected by the projector module PJ can be    adjusted with ease.

It is desirable that the projector module PJ be locked at the casing ofthe electronic apparatus by using the mounting portions 25A and 25B soas to come into surface contact (surface-to-surface contact) with achassis or the like achieving a high level of thermal conductivity,since the heat releasing effect can be further enhanced with the heatconducted from the optical image forming block 30 to the locking member25 further transferred to the chassis.

If the electronic apparatus at which the projector module PJ is mounteddoes not include a metal chassis, surface contact should be achievedbetween a backlight heat releasing member, which releases heat generatedat a backlight, (not shown) of the liquid crystal display 12 (see FIG.1), and the mounting portions 25A and 25B of the projector module PJ.

Alternatively, the mounting portions 25A and 25B may achieve surfacecontact with a heat releasing member or the like for the powertransistor, instead of the backlight heat releasing member.

Second Embodiment

FIGS. 4A to 4E present five-view diagrams of a projector module PJachieved in the second embodiment of the present invention, with FIG. 4Apresenting a rear view, FIG. 4B presenting a bottom view, FIG. 4Cpresenting a left side elevation, FIG. 4D presenting a front view andFIG. 4E presenting a right side elevation. The second embodiment differsfrom the first embodiment in that, the optical block and the opticalimage forming block are constituted as a single block. The moduleconstituted as a single block is then integrated with a locking member125 (third member). The locking member 125 may be formed by bending ametal sheet such as an aluminum plate through a sheet metal bendingprocess. The locking member 125 includes mounting portions 125A and 125B(mounting margins) each having formed therein a threaded retaining hole,and the projector module PJ is locked in a casing of the electronicapparatus via the mounting portions 125A and 125B.

FIG. 5 is a sectional view taken along G-G′ in FIG. 4E. FIG. 5 showsthat a substrate 121B is disposed at a casing 126 (second member). Thecasing 126 is formed by using a material such as plastic with lowthermal conductivity. The substrate 121B (first member) is an aluminumsubstrate and a white-color LED 121A (light emitting device) capable ofemitting bright light is mounted on a pattern formed on the substrate121B. The LED 121A illuminates a liquid crystal panel 122 (light valveor light modulating member) at a brightness corresponding to the levelof the electrical current supplied thereto via a harness 121C. Theliquid crystal panel 122 is constituted by sealing liquid crystalbetween glass plates 122A and 122B. It is to be noted that the liquidcrystal panel 122 may be either a color display or a monochrome display.

A condensing member 127 (separation means) is disposed between the LEDsubstrate 121B (LED 121A) and the liquid crystal panel 122. Thecondensing member 127 is a Fresnel lens formed by using a resinmaterial, which also has a function of dividing the space inside thecasing 126 into separate spaces, i.e., a space toward the LED 121A and aspace toward the liquid crystal panel 122.

The liquid crystal panel 122 is driven by a drive signal used toreproduce an image, text or the like. As the light from the LED 121A ismodulated in conformance to the drive signal, an optical image isgenerated at the liquid crystal panel 122. The light flux having beentransmitted through the liquid crystal panel 122 advances to the rightin FIG. 5 to enter a lens 123. The lens 123 functions as a projectionoptical system in this structure.

The light flux having entered the lens 123 is condensed and exitsthrough the projector projecting port 20. The lens 123 is a lens groupconstituted with a plurality of lenses disposed inside a lens barrel124. A screw thread is formed at the external circumference of the lensbarrel 124, which interlocks with a screw thread formed at the internalcircumference of the casing 126. As the lens barrel 124 is rotatedaround the optical axis Ax in FIG. 5, the lens 123 is driven toadvance/retreat along the optical axis Ax and the focus of the imageprojected by the projector module PJ is adjusted.

As shown in FIGS. 4A through 4C, the locking member 125 clamps thesubstantially rectangular parallelepiped casing 126 on five surfaces.Explicitly, it is conjoined with the corresponding surfaces of thecasing 126 so as to cover the casing 126 from five directions, from theleft, from the bottom, from the right and from the top in FIG. 4C andalso from above the drawing sheet surface (along the directionperpendicular to the drawing sheet surface). A hole 125Y (see FIG. 4A)and a hole 125X (see FIG. 4D) are formed at the surface facing front inFIG. 4A and the surface facing front in FIG. 4D respectively among thesurfaces of the locking member 125 conjoined with the casing 126. Theseholes 125Y and 125X are formed so as to interlock respectively with aprojecting portion 126Y and a projecting portion 126X of a casing 126when the casing 126 is held by the locking member 125. Thus, the lockingmember 125 and the casing 126 can be provided as an integrated unitwithout having to use screws, an adhesive or the like.

In addition, among the surfaces of the locking member 125 conjoined withthe casing 126, the surface facing front in FIG. 4C is formedspecifically to achieve surface contact with the substrate 121B and isconjoined after a thermally conductive packing material (such as asilicon grease) is applied thereto. Also, at this particular surface ofthe locking member 125, a hole 125Z is formed so as to partially exposethe substrate 121B when the locking member 125 clamps the casing 126.

It is desirable that as the projector module PJ formed as an integratedunit as described above is locked at the casing of the electronicapparatus, the exposed portion of the substrate 121B be set at aposition near the ventilating holes of the electronic apparatus.

The following operational effects can be achieved in the secondembodiment described above.

-   (1) Since the optical block (lens 123) and the optical image forming    block (casing 126) are constituted as a single block, the projector    module PJ can be provided as a more compact unit compared to a    projector module that includes a plurality of blocks.-   (2) The condensing member 127 divides the space inside the casing    126 into separate spaces, i.e., a space toward the LED 121A and a    space toward the liquid crystal panel 122. As a result, heat    generated on the LED side is not allowed to be transmitted toward    the liquid crystal panel side through diffusion of the heat in the    internal air.

The condensing member 127 may be a diffusive member. In such a case, theeffective area at the liquid crystal panel 122 is evenly illuminated soas to achieve a high image quality in the projected image by minimizingany inconsistencies in brightness over the entire projected image plane.

While the locking member 125 clamps the substantially rectangularparallelepiped casing 126 on five surfaces, it may hold the casing 126on three surfaces or four surfaces instead of five surfaces. It shouldbe ensured, however, that the locking member 125 clamps the casing 126on at least three surfaces, i.e., two surfaces facing opposite eachother and a surface ranging perpendicular to the two surfaces. Forinstance, the locking member 125 may be conjoined with correspondingsurfaces of the casing 126 from three directions, i.e., from the leftand from the right in FIG. 4C and also from above the drawing sheetsurface, so as to cover the casing 126 on the three sides.

While an explanation is given above on an example in which the casing126 assumes a rectangular parallelepiped shape, i.e., the shape of aquadrangular prism, the casing 126 may instead be formed in the shape ofa pentagonal prism or a hexagonal prism.

The condensing member 127 may also be used in conjunction with theprojector module PJ achieved in the first embodiment.

While the projector module PJ is mounted on the handheld portabletelephone 10 in the example explained above, it may instead be mountedat a portable electronic apparatus other than the portable telephone 10,such as a laptop computer, a PDA, an electronic camera, or a playbackapparatus.

In addition, instead of providing the projector module in conjunctionwith another electronic apparatus, a projector device having only theprojecting function of the projector module PJ may be provided. FIGS. 6Aand 6B show the internal arrangement of a projector device, with FIG. 6Apresenting a plan view and FIG. 6B presenting a side elevation. Achassis 63 is disposed inside a casing 60, and a main substrate 61, apower supply unit 62 and a projector module PJ are disposed on thechassis 63. The projector module PJ includes the locking member 25, theoptical image forming block 30 and the optical block 40.

The power source unit 60 provides power to the main substrate 61. As animage signal is input from an external apparatus via an interfaceconnector 64, a liquid crystal drive circuit (not shown) formed on themain substrate 61 provides a drive signal to the liquid crystal panel 22of the optical image forming block 30 via a harness 21D and an LED drivecircuit (not shown) supplies a drive current to the LED 21A via aharness 21C.

While an explanation is given above in reference to the first and secondembodiments on an example in which a white light source is used as theprojector light source, the present invention may also be adopted inconjunction with color (a plurality of colors) light sources used as thelight source for a liquid crystal panel with monochrome displaycapability. Namely, LEDs that emit light in different colors may beturned on sequentially through time division and as the LEDs emitdifferent colors of light, the liquid crystal panel may be drivensequentially through time division with image signals (drive signals)each corresponding to a given color of light. The optical images in thevarious colors sequentially projected through time division will beobserved by the user as a color image. The plurality of colors may bethe three primary colors, R (red), G (green) and B (blue) or they may beY (yellow) and B (blue).

In the first and second embodiments described above, the light emittingdevice is disposed at the first member achieving a high,level of thermalconductivity, the first member and the light valve or light modulatingmember are disposed at the second member that does not have high thermalconductivity, the second member and the projection optical system aresupported as an integrated unit by the thermally conductive thirdmember, and the first member and the third member are made to achievesurface contact. As a result, the heat generated at the light emittingdevice is released through the first member and the third member and, atthe same time, it is ensured that the heat is not transferred readily tothe light valve. The structure assures a high level of heat releasingperformance without having to use a Peltier element or the like andmakes it possible to provide a compact projector device to be mounted atan electronic apparatus.

The following is an explanation of an illuminating device achieved inthe third embodiment of the present invention. The illuminating devicein the third embodiment is constituted as a liquid crystal projectormodule.

FIG. 7 shows the liquid crystal projector module PM achieved in thethird embodiment, which is fitted in an electronic apparatus. Theprojector module PM is a compact unit, and the electronic apparatus intowhich the projector module is fitted may be a digital camera, a portabletelephone or the like as well as a compact projector device. A casing200 of the electronic apparatus is constituted of a thermally conductivemetal such as die-cast aluminum.

The projector module PM includes a light source unit, an image formingunit, a projection unit and a heat transfer unit that are integratedinto a single component in advance. A high output LED 201 used as thelight source is mounted at an LED substrate 202 constituted of metal.The LED substrate 202 may be constituted by forming a conductive circuitwith a copper pattern on the top surface of, for instance, an aluminumplate via a thermally conductive insulating layer, and a surface of theconductive circuit is used as the mounting surface at which the LED 201is mounted. At a surface (lower surface) 202 a of the LED substrate 202,located on the opposite side from the mounting surface, a metal portionis exposed.

A light projector lens 211 is disposed over the LED substrate 202, aliquid crystal panel 203 constituting an image forming member isdisposed at a frame 212 provided as an integrated part of the LEDsubstrate 202, and a polarizing beam splitter (PBS) 204 constituting aprojection unit is disposed further upward via a frame 213. APBS film204 a forms a 45° angle relative to the optical axis of the LED light. Aquarter-wave plate 205 and a reflecting mirror 206 are disposed furtherrear word relative to the PBS 204 (to the right in the figure), and thereflecting surface of the mirror 206 may be formed as a sphericalsurface or a non-spherical surface. It is to be noted that referencenumeral 231 indicates an electrical wiring through which the liquidcrystal panel 203 is controlled, and reference numerals 232 and 233 eachindicate an electrical wiring through which the LED 201 is controlled.

As an image is formed at the liquid crystal panel 203 and the LED 201 isturned on, the light from the LED is transmitted through the liquidcrystal panel 203 via the lens 211, thereby forming projection light forimage projection. The projection light reaches the PBS 204 and isreflected rearward at the PBS film 204 a. After passing through thequarter-wave plate 205, the reflected light is further reflected forward(to the left in the figure) at the reflecting mirror 206 and passesthrough the quarter-wave plate 205 again. The light having undergone theprocess of polarization conversion by passing through the quarter-waveplate 205 twice is then transmitted through the PBS 204 and is projectedonto an external screen (not shown) through an aperture 213 a and anopening 251 at the casing 200.

In order to display a bright, clear image on the screen, the LED 201used as the light source must emit bright light and a large electricalcurrent (e.g., 400 mA) must be supplied to the LED 201 to enable brightlight output. As a result, a great deal of heat is generated at the LED201, which causes the concern of possible adverse effects from heat.

Accordingly, a metal block (heat transfer block) 220 is disposed underthe LED substrate 202 so as to minimize the extent to which thetemperature at the LED 201 rises via the metal block 220. The metalblock 220 is formed by processing a material with high heat conductivitysuch as aluminum or copper into the shape of a substantiallyquadrangular prism. Its upper surface is placed in surface contact withthe lower surface (exposed metal portion) of the LED substrate 202. AsFIG. 8 indicates, the position at which the metal block 220 is disposed(directly under the LED 201) corresponds to the mounting position atwhich the LED 201 is mounted. The metal block 220 may be mounted at theLED substrate 202 by using a screwing means, or the metal block 220 maybe fitted at a fitting portion of the substrate 202.

The structure described above allows the heat generated at the LED 201to be sequentially released through the LED substrate 202 constituted ofmetal and the metal block 220, and, as a result, the increase in thetemperature at the LED 201 can be minimized. In particular, since a sidesurface and the lower surface of the metal block 220 achieve surfacecontact with the inner surface of the casing 200, as shown in FIG. 7,the heat at the metal block 220 can be released to the outside with ahigh degree of efficiency through the casing 200 so as to minimize theincrease in the temperature at the LED 201 even more effectively in thethird embodiment.

When a heat generating element is set in contact with a thermallyconductive member (heat transfer member) so as to release the heat atthe heat generating element by transferring it to the heat transfermember, the heat is primarily transferred at the heat transfer memberalong a direction perpendicular to the surface that is in contact withthe heat generating element and only a small quantity of heat istransferred along the direction extending along the contact surfaceunder normal circumstances. Namely, in the example described above, theheat generated at the LED 201 is primarily transferred downward alongthe vertical direction at the heat transfer member (the LED substrate202 and the metal block 220 in this example) and no significant quantityof heat is transferred along the lateral direction. This means that theheat from the LED 201 can be released more efficiently by setting themetal block 220 so that its longer side runs along the verticaldirection rather than by setting the metal block 220 so that its longerside sits horizontally. Accordingly, the lateral measurement of themetal block 220 achieved in the third embodiment is set to the smallestpossible value while the height of the metal block 220 is maximized.

While it is more desirable to set the height of the metal block 220 tothe greatest possible value, a significant advantage can be achieved aslong as the following relationship is satisfied.

With A, B and C in FIG. 9 respectively representing the thickness of theLED substrate 202, the height of the metal block 220 and the distancefrom the LED 201, i.e., the heat generating element, to an end surfaceof the metal block 220 (the distance over which the heat is transferredalong the horizontal direction), the height B should be determined so asto satisfy the relationship express as in (1) below.A+B>C   (1)

FIG. 10 presents an example of the results of tests conducted by theinventors of the present invention.

In FIG. 10, the length of time over which the LED 201 remained on isindicated along the horizontal axis and the temperature at the LED 201is indicated along the vertical axis. L1 represents a case in which onlythe metal LED substrate 202 was used and no metal block 220 was includedin the structure, whereas L2 and L3 each represents a case in which themetal LED substrate 202 and the metal block 220 satisfying therelationship expressed in (1) were used in combination. While the shapesof the metal blocks 220 used in the cases corresponding to L2 and L3were similar, the metal block 220 in case L2 was constituted with analuminum material in the A5000s and the metal block 220 in case L3 wasformed by using an aluminum material in the A6000s.

As FIG. 10 indicates, the temperature at the LED 201 increased as theLED 201 became turned on in each of the cases described above. When nometal block 220 was used, as in case L1, the LED temperature reached alevel close to 90° within approximately 60 seconds after the LED 201 wasturned on. In contrast, when the metal block 220 constituted of analuminum material in the A5000s was used, the temperature was kept downat approximately 72° even after two minutes or more elapsed, asindicated by L2. Furthermore, the temperature is kept down toapproximately 55° even when two minutes or more elapsed in the structurethat included the metal block constituted with an aluminum material inthe A6000s with a higher level of thermal conductivity, as indicated byL3. In addition, although not indicated in the test results, an aluminummaterial in the A1000s, too, achieves a high level of thermalconductivity and, accordingly, favorable results are likely to beachieved by using a metal block constituted with an aluminum material inthe A1000s, as well.

As described above, the vertically elongated metal block 220 is includedto minimize the extent to which the temperature rises at the LED 201,and thus, any damage due to the heat from the LED 201 is prevented eventhough a large current is supplied to the LED 201 in the thirdembodiment. For this reason, an expensive and large scale heat releasing(cooling) device such as a cooling fan or a Peltier element, is notnecessary. In addition, since the metal block 220 does not rangesignificantly along the horizontal direction, the entire projectormodule PM is allowed to assume a vertically elongated shape and themetal block 220 does not project out further along the horizontaldirection beyond the image forming unit or the projection unit. This, inturn, increases the degree of freedom with which other members aredisposed inside the casing 200 together with the projector module PM.

In addition, the heat transfer unit (the metal block 220 and the LEDsubstrate 202), the light source unit (the LED 201), the image formingunit (the liquid crystal panel 203) and the projection unit (the PBS204, the mirror 206 and the like) stacked along a single directionconstitutes a single unit and the optical axis OX of the light projectedby the projection unit is set along a direction perpendicular to thestacking direction. As a result, with the individual members disposed asshown in FIG. 7, the optical axis OX of the projection light can begreatly distanced from the lower surface of the casing 200, i.e., fromthe installation surface. If the projection light axis extends close tothe installation surface, an image cannot be projected onto the externalscreen with ease and, accordingly, measures such as projecting the imageupwards along a diagonal direction will need to be taken.

FIGS. 11 through 18 show examples of variations of the third embodiment.In each of these embodiments, the height of the metal block satisfiesthe relationship expressed in (1) above.

FIG. 11 shows a projector module PM having a metal block 221 locked tothe LED substrate 202 via a thermally conductive bonding member 231.This structure facilitates the assembly process, and even if there aresurface irregularities at the contact surfaces of the metal block 221and the substrate 202, such irregularities can be absorbed and a highlevel of contact adhesion can be assured so as to maximize the thermalconduction efficiency. A thermally conductive elastic sheet may bedisposed between the surfaces of the metal block and the substrate aswell. While the height of the metal block 221 is smaller than that inthe example presented in FIG. 7 and the extent of the temperatureincrease at the LED is not inhibited as effectively for this reason, amore compact structure is achieved.

FIGS. 12 and 13 each show a projector module PM having a metal blockassuming a different shape. The projector module PM in FIG. 12 includesfins 222 a formed at the bottom of a metal block 222 and thus, theefficiency with which the heat is released into the air is improved byincreasing the heat releasing area. This structure will be particularlyeffective in a situation in which convection of air readily occurs nearthe fins 222 a. In the projector module PM in FIG. 13, the lower endsurface of a metal block 223 assumes a spherical shape so as to increasethe heat releasing area and improve the heat releasing efficiency.

FIG. 14 presents an example of a projector module PM having apositioning boss 224 a disposed at a side surface of a metal block 224.By inserting the boss 224 a at a positioning hole 251 a formed at acasing 251 of the electronic apparatus, the position of the projectormodule relative to the casing 251 can be determined so as to facilitatethe process of mounting the projector module PM at the casing 251.

FIGS. 15 through 17 each present an example of a projector module PM inwhich the metal block includes a mounting portion to be used whenmounting the projector module at a casing. In the projector module PM inFIG. 15, a screw through hole 225 a is formed at a metal block 225, andthe projector module PM is mounted by inserting a screw 230 into thehole 225 a and then threading the screw into a threaded hole 252 a at acasing 252.

The projector module PM in FIG. 16 is locked by fitting the bottomportion of a metal block 226 in a fitting portion 253 a at a casing 253and interlocking a clasp 253 b of the fitting portion 253 a in a groove226 a at the metal block 226. The fitting portion 253 a at the casing253 is constituted with an elastic material (e.g., plastic) and theclasp 253 b is interlocked at the groove 226 a as the fitting portionundergoes elastic deformation. This structure greatly facilitates theprocess of mounting the projector module PM. The projector module PM inFIG. 17 is locked by inserting a boss 254 a at a casing 254 into a hole227 a formed at the bottom of a metal block 227 so as to range alonglongitudinal direction.

By adopting any of the structures shown in FIGS. 14 through 17, themetal block, which functions primarily as a heat transfer block, isallowed to provide an additional function such as that of a positioningmember or a mounting member. As a result, a reduction in the number ofrequired parts is achieved.

FIG. 18 shows an embodiment achieved by directly mounting an LED at ametal block. At the projector module PM in FIG. 18, a conductive circuitis formed via an insulating layer over the upper surface of a metalblock 228 constituted of, for instance, aluminum and the LED 201 isdirectly mounted at the conductive circuit. The height of the metalblock 228 is set greater than the lateral distance between the mountingposition at which the LED 201 is mounted and an end of the mountingsurface. In addition, the lens 211 and the frame 212, too, are directlyfixed onto the metal block 228. This structure allows the heat generatedat the LED 201 to be directly transferred to the metal block 228,achieving a higher level of thermal conduction efficiency than the thirdembodiment and the other variations explained earlier and thus, theextent of the temperature increase at the LED 201 can be moreeffectively inhibited. In addition, since no LED substrate is included,the number of required parts is reduced, which assures ease of assemblyand low production costs.

When the LED 201 is directly mounted at the metal block 228 as shown inFIG. 18, too, a positioning portion or a mounting portion used toposition the projector module relative to an electronic apparatus or tomount the projector module at the electronic apparatus, such as any ofthose shown in FIGS. 14 through 17, may be induced in the metal block228.

It is to be noted that the metal block may assume a shape other thanthose in the examples presented in FIGS. 7 through 18, and it mayassume, for instance, a cylindrical shape. In addition, the imageforming member does not need to be a transmission-type liquid crystalpanel and it may instead be a reflective liquid crystal or another typeof image forming member. Furthermore, while an explanation is givenabove on an example in which the present invention is adopted inprojector modules, the present invention may also be adopted in othertypes of illuminating modules that use LEDs as light sources, such as anLED flash module in a camera and an AF auxiliary illuminating module.

In the third embodiment and its variations explained above, the LED ismounted at the mounting surface of the metal substrate, the heattransfer block constituted of metal is set in surface contact with thesurface of the metal substrate located on the side opposite from themounting surface at a position corresponding to the mounting position atwhich the LED is mounted, and the sum of the thickness of the metalsubstrate and the length of the heat transfer block extending along thedirection perpendicular to the mounting surface is set greater than thelateral distance from the LED mounting position to an end of themounting surface. As a result, the heat generated at the LED can bereleased from the metal substrate to the heat transfer block efficientlyand the extent to which the temperature at the LED rises can beminimized without having to include a large-scale device.

In addition, by mounting the LED at the mounting surface of the metalheat transfer block and ensuring that the length of the heat transferblock along the direction perpendicular to the mounting surface isgreater than the lateral distance from the LED mounting position to anend of the mounting surface, as shown in FIG. 18, advantages similar tothose described above can be achieved.

Fourth Embodiment

An illuminating device achieved in the fourth embodiment of the presentinvention is now explained in reference to FIGS. 19 and 20. Theilluminating device in the fourth embodiment is constituted as a liquidcrystal projector.

FIG. 19 is a front view of the liquid crystal projector achieved in thefourth embodiment and FIG. 20 is a sectional view taken along lineII-II. A casing 310 of the projector is constituted of a metal materialachieving a high level of thermal conductivity, e.g., die-cast aluminum.Legs 311 b are disposed at the four corners of a lower surface 311 a ofthe casing 310 so as to form a gap between a surface P of a desk or thelike on which the casing 310 may be placed and the casing lower surface311 a.

The following components are housed inside the casing 310.

LEDs 301 capable of emitting very bright light, which are used as alight source, are mounted at a metal LED substrate 302. The LEDsubstrate 302 includes a conductive circuit formed at the upper surfaceof, for instance, an aluminum plate via a thermally conductiveinsulating layer, with the LEDs 301 mounted at the upper surface thereofand a metal portion exposed at a lower surface 302 a thereof. Thesubstrate 302 is disposed so that its lower surface 302 a comes intocomplete contact (surface contact) with a bottom surface 311 c of thecasing 310 and is fixed onto the casing 310 with screws BS. Fins 312 areformed at a casing lower surface 311 a so as to project out and recessunder the substrate 302.

Above the LED substrate 302, a liquid crystal panel 303 constituting animage forming member is disposed and, above the liquid crystal panel303, a polarizing beam splitter (PBS) 304 constituting a light pathaltering member is disposed. A PBS film 304 a forms a 45° angle relativeto an optical axis L of the LED light. Further rearward relative to thePBS 304, a quarter-wave plate 305 and a reflecting mirror 306 aredisposed. The mirror 306 constitutes a projection optical system and itsreflecting surface may be a spherical surface or a non-sphericalsurface.

At a control circuit substrate 307 disposed to the rear of the mirror306, a control IC 308 is mounted and one end of an external cable (e.g.,a USB cable) 309 is connected to the control circuit substrate 307. Thecontrol IC 308 is electrically connected with the LED substrate 302 andthe liquid crystal panel 303 via a wiring member 321. Power and controlsignals are supplied from-an external apparatus (not shown) via thecable 309 and the control IC 308 implements on/off control of the LEDs301, drive control for the liquid crystal panel 303 and the like inresponse to signals input thereto.

As an image is formed at the liquid crystal panel 303 and the LEDs 301is turned on, the light generated at the LEDs 301 is transmitted throughthe liquid crystal panel 303, reaches the PBS 304 and is reflectedrearward (to the right in the figure) at the PBS film 304 a. Afterpassing through the quarter-wave plate 305, the reflected light isreflected forward (to the left in the figure) at the reflecting mirror306 and passes through the quarter-wave plate 305 again. The lighthaving undergone the process of polarization conversion by passingthrough the quarter-wave plate 305 twice is then transmitted through thePBS 304 and is projected to the outside through an aperture 322 locatednear the exit. The use of such an optical system makes it possible toprovide the illuminating device as a compact unit that is still capableof minimizing the extent of chromatic aberration.

While the LEDs 301, to which a large current is supplied, generate asignificant quantity of heat, the heat is transferred to the metal LEDsubstrate 302 and is released to the outside via the metal casing 310.Since the substrate lower surface 302 a is in complete contact (surfacecontact) with the bottom surface 311 c of the casing 310, the heat fromthe LEDs 301 can be efficiently transferred to the casing 310. Inaddition, the casing 310 faces the external space over a large area and,for this reason, the heat at the casing can be released to the outsideefficiently. In particular, the temperature at the casing lower surface311 a over the area directly under the LED substrate 302 reaches thehighest level, but since the fins 312 are formed over this area, theheat releasing area is increased to achieve a high level of heatreleasing efficiency. For this reason, even though a large current issupplied to the LEDs 301, the heat from the LEDs 301 does not causedamage. Moreover, no substantial increase in the number of requiredcomponents is necessitated since no cooling fan, metal heat releasingmember, Peltier element or the like needs to be added, unlike in therelated art.

It is to be noted that since the gap created between the casing lowersurface 311 a and the surface P upon which the projector is installed isopen on four sides, heat is not trapped in this space.

Disposing the LED 301 close to the lower surface of the casing 310, asdescribed above, is advantageous especially for the following tworeasons.

First, the heat from the LEDs 301 is primarily released through thecasing lower surface 311 a, i.e., the temperature rises to the highestlevel at the lower surface 311 a in the casing 310. Since the lowersurface 311 a is the portion least likely to come into direct contactwith the user, the user is almost completely spared any discomfortattributable to the heat from the LEDs 301. In addition, by disposingthe LEDs 301 near the lower surface of the casing 310, the light fromthe LEDs can be irradiated upward and then can be bent along thehorizontal direction for a projection. This structure achieves a highlyefficient utilization of the available space and the optical axis L ofthe projection light can be set at a highest possible position, i.e., ata position distanced from the surface P upon which the projector isinstalled, without having to increase the bulk of the casing 310. It isto be noted that if the optical axis L is set to close to the surface Pupon which the projector is installed, the image cannot easily beprojected onto the external screen with ease and, for this reason,measures such as projecting the image upward along a diagonal directionneed to be taken.

It is to be noted that an elastic sheet achieving a high level ofthermal conductivity maybe inserted between the lower surface 302 a ofthe LED substrate 302 and the casing bottom surface 311 c. The elasticsheet present between the lower surface 302 a and the casing bottomsurface 311 c will absorb any irregularities that may be present at thesurfaces 302 a and 311 c to assure good contact and maximum efficiencyin thermal conduction.

Fifth Embodiment

FIG. 21 shows an illuminating device achieved in the fifth embodimentand FIG. 22 is a sectional view taken along line IV-IV in FIG. 21. FIGS.21 and 22 show an example in which the LEDs 301 is directly mounted atthe lower surface of a metal casing 310′. In FIGS. 21 and 22, the samereference numerals are assigned to components having functions similarto those in FIGS. 19 and 20.

A conductive circuit is formed via an insulating layer at the uppersurface of a mounting portion 331 formed as an integrated part of thecasing bottom surface 311 c, and the LEDs 301 can be directly mounted atthe conductive circuit. The fins 312 similar to those described earlierare formed at the casing lower surface 311 a at a position under themounting portion 331. This structure allows the heat from the LEDs 301to be directly transferred to the casing 310′, achieving superiorthermal conduction efficiency, i.e., superior heat releasing efficiency,over the previous embodiments, and since no LED substrate is included, areduction in the number of required parts is achieved.

It is to be noted that there are no specific restrictions to be imposedwith regard to the position at which the LEDs should be disposed andthat the LED substrate 302 may be mounted or the mounting portion 331may be formed at a location other than the bottom surface. In addition,while an explanation is given above on an example in which the entirecasing is constituted of metal, part of the casing may be constituted ofplastic or the like as long as the area where the LED substrate 302 ismounted or the mounting portion 331 is formed, at least, is constitutedof metal, instead. Furthermore, the image forming member does not needto be a transmission-type liquid crystal panel and it may instead be areflective liquid crystal or another type of image forming member. Whilean explanation is given above on an example in which the presentinvention is adopted in projectors, the present invention may also beadopted in other types of illuminating devices that use LEDs as lightsources, such as a camera having an LED flash and a camera that uses anLED as a light source for AF auxiliary light.

In the fourth and fifth embodiments described above, at least part ofthe casing is constituted of metal and the LEDs are mounted at a metalsubstrate that is locked onto the metal portion of the casing, or theLEDs are directly mounted at the inner surface of the metal portion ofthe casing. Thus, the heat generated from the LEDs are efficientlytransferred to the casing and the heat can then be released to theoutside through the casing. These highly efficient heat releasingstructures are realized without having to provide a special cooling fan,Peltier element or the like.

Sixth Embodiment

The following is an explanation of an illuminating device achieved inthe sixth embodiment of the present invention. The illuminating devicein the embodiment is constituted as a projector.

FIG. 23 is a front view of the liquid crystal projector achieved in thesixth embodiment and FIG. 24 is a sectional view of the liquid crystalprojector taken along line A-A′. A projector 400 includes a first casing411 in which an optical block is housed and a second casing 412 which isused as a seat for the first casing 411. The second casing 412 includesan optical system bearing portion 412 s assuming the shape of part of aspherical surface, whereas the first casing 411 includes a seat contactportion 411s assuming the shape of part of a spherical surface. Theoptical system bearing portion 412 s and the seat contact portion 411 sare formed so as to achieve surface contact while they are allowed toslide against each other freely. This structure, which is similar tothat of a ball joint, allows the orientation of the first casing 411disposed on the second casing 412 to be adjusted freely. Both the firstcasing 411 and the second casing 412 are formed by using a material withlow thermal conductivity such as plastic.

The structure of the optical block housed inside the first casing 411 isnow explained. LEDs 422 capable of emitting light with a high level ofbrightness, which are used as the light source, are mounted on a metalsubstrate 421. The metal substrate 421 (mounting substrate), which maybe, for instance, an aluminum substrate, includes a pattern formed on athermally conductive insulating layer present at a component mountingsurface or upper surface (the upper side in FIG. 24) and the LEDs 422are mounted on the pattern. The metal substrate 421 is attached so thatpart of the component mounting surface comes in contact with a substratebearing portion D (see FIG. 23) of the first casing 411, with a metalportion exposed at a lower surface 421 a of the metal substrate 421.

The LEDs 422 illuminate a transmission-type liquid crystal panel 423with a brightness corresponding to an electrical current supplied via aharness 420. The liquid crystal panel 423 is driven by a drive signalprovided via the harness 420, in response to which an image or the likeis reproduced. More specifically, a voltage corresponding to the densityof each pixel in the image is applied to the liquid crystal layer, andthe arrangement of the liquid crystal molecules in the liquid crystallayer to which the voltage has been applied changes, causing thetransmittance of the light at the liquid crystal layer to change inunits of individual pixels. At the liquid crystal panel 423 havingundergone the change in the transmittance as described above, the lightfrom the LEDs 422 is modulated and an optical image is generated. Thelight flux having been transmitted through the liquid crystal panel 423advances upward in FIG. 24 and enters a prism block 432. It is to benoted that the liquid crystal panel 423 may be either a color display ora monochrome display.

The prism block 432 is constituted with a polarizing beam splitter (alight path altering member, hereafter referred to as a PBS) having twotriangular prisms 432 a and 432 b sandwiching a polarizing beamsplitting plane 431 which forms a 45° angle relative to the optical axisAx of the light from the LEDs. At the exit surface on the right side ofthe PBS 432, a reflecting mirror 433 is disposed via a quarter-waveplate 434. The reflecting mirror 433 having a reflective surface formedto achieve a predetermined curved contour (either a spherical surface ora non-spherical surface) constitutes a projection optical system of theprojector 400.

To the right of the reflecting mirror 433, a control circuit substrate436 is disposed. A drive IC 424 is mounted at the control circuitsubstrate 436, and power and control signals are provided to the controlcircuit substrate 436 from an external apparatus (not shown) via anexternal cable (e.g., a USB cable) 425. The drive IC 424 outputs signalsto be used to implement on/off control of the LEDs 422 and drive theliquid crystal panel 423 to the LEDs 422 and the liquid crystal panel423 respectively via the harness 420 in response to the control signals.

The S polarized light component of the light flux having beentransmitted through the liquid crystal panel 423 and then having enteredthe PBS 432 is reflected at the polarizing beam splitting plane 431 andadvances to the right. The reflected light flux having advanced to theright exits the PBS 432, and is reflected at the reflecting mirror 433via the quarter-wave plate 434. The reflected light flux then reentersthe PBS 432 via the quarter-wave plate 434. The light flux havingreentered the PBS 432 will have undergone the process of polarizationconversion and become a P polarized light component while it has passedthrough the quarter-wave plate 434 twice. Thus, it is transmittedthrough the polarizing beam splitting plane 431 at the PBS 432 andadvances to the left.

The transmitted light flux having advanced to the left exits the PBS 432and further advances to the left before it is projected to the outsidevia an aperture 435. As a result, the optical image formed at the liquidcrystal panel 423 is projected toward a screen (not shown) or the like.By using a projection optical system such as this, that does not includea refractive lens, the illuminating device is provided as a compact unitthat is still capable of minimizing the extent of chromatic aberration.

Now, the structure of the second casing 412 (seat) is explained. Thesecond casing 412 is set on a projector placement surface orinstallation surface 490 so as to allow an installation surface (thelower side in FIG. 24) of an installation portion 413 and the projectorplacement surface 490 to achieve surface contact with each other. Theprojector placement surface 490 may be the upper surface of a desk, atable or the like, a wall, a ceiling, a column or the like. An opening His formed at the mounting surface of the mounting portion 413, so as toexpose at least part of the lower surface 421 a of the metal substrate421 toward the placement surface 490. The lower surface 421 a of themetal substrate 421 faces opposite the placement surface 490.

As the projector 400 is placed on the placement surface 490, a gap isformed between the lower surface 421 a of the metal substrate 421 andthe placement surface 490 so as to ensure that a layer of air is presentbetween them. In addition, the installation portion 413 also acts as aguard member, as explained below, when the orientation of the firstcasing 411 is adjusted on the second casing 412. When the orientation ofthe first casing 411 on the second casing 412 is altered, the angleformed by the metal substrate 421 fixed onto the first casing 41i andthe installation surface of the installation portion 413 also changes.When this angle becomes large, a risk of the lower surface 421 a of themetal substrate 421 coming into contact with the placement surface 490arises. Accordingly, the lower surface 421 a is made to first come intocontact with the installation portion 413 rather than the placementsurface 490 to prevent the lower surface 421 a from contacting theplacement surface 490.

As a large electrical current is supplied to the LEDs 422 in theprojector 400, the LEDs 422 generate a significant quantity of heat. Theheat thus generated is transferred to the metal substrate 421 and isreleased to the air layer through the lower surface 421 a of the metalsubstrate 421. While the temperature at the metal substrate 421 rises tothe highest level over the area directly under the LEDs 422, this areais located within the space enclosed by the second casing 412 and theplacement surface 490 and thus, the user does not inadvertently touchthe heated area. In addition, since the placement surface 490 is notdirectly exposed to the heat, the increase in temperature at theplacement surface 490 is minimized.

The following operational effects can be achieved in the sixthembodiment explained above.

-   (1) As the projector 400 is placed on the placement surface 490, an    air layer is formed between the metal substrate 421 at which the    LEDs 422 are mounted and the placement surface 490. As a result, the    heat can be released to the air layer reliably without directly    exposing the placement surface 490 to the heat. Thus, a compact and    power efficient projector 400 is provided without having to add a    special metal heat releasing member such as a heat sink or fins, a    fan or a Peltier element.-   (2) The area of the metal substrate 421 where the temperature rises    to the highest level, i.e., the area directly under the LEDs 422, is    positioned within the space enclosed by the second casing 412 and    the placement surface 490 so as to ensure that the user does not    inadvertently touch the heated area and experience discomfort.-   (3) A mechanism similar to that of a ball joint is adopted to allow    the orientation of the first casing 411 disposed on the second    casing 412 to be adjustable. As a result, even after the projector    400 is locked on the placement surface 490, the direction along    which the light emitted from the LEDs 422 advances (the direction    along which the light is projected by the projector 400) can be    adjusted. In addition, since the installation portion 413 of the    second casing 412 also acts as a guard member, the metal substrate    421 is not allowed to come into contact with the placement surface    490 while adjusting the orientation of the first casing 411.-   (4) The central line (the-optical axis Ax) of the light flux emitted    from the LEDs 422 is set substantially perpendicular to the    placement surface 490 and the light flux is bent at the PBS 432 for    projection. Thus, a wide clearance is created between the optical    axis Ax2 (see FIG. 24) of the light flux having been bent and the    placement surface 490. Since this assures a sufficient height for    the projection light axis, a partial eclipse of the projection light    flux at the placement surface 490 is prevented.

The installation portion 413 of the second casing 412 may be constitutedby using a magnetic material or it may be constituted as a suction diskso as to achieve contact through suction.

The opening H formed at the installation surface of the installationportion 413 allows the heat to be readily released to the air layerthrough the lower surface 421 a of the metal substrate 421 and also theedge of the opening H acts as a guard member that prevents the lowersurface 421 a of the metal substrate 421 from contacting the placementsurface 490. Alternatively, the opening H may be covered with a meshmember or the opening H may be formed as a slit.

Seventh Embodiment

FIG. 25 is a sectional view of a liquid crystal projector 400B achievedin the seventh embodiment of the present invention. In FIG. 25, the samereference numerals are assigned to members identical to those in FIG. 24in reference to which the sixth embodiment has been explained topreclude the necessity for a repeated explanation thereof. The projector400B includes a first casing 451 in which an optical block is housed anda second casing 452 used as a seat for the first casing 451.

The second casing 452 (seat) is set on the placement surface 490 so asto allow an installation portion 453 and the projector placement surface490 to achieve surface contact with each other. Threaded holes areformed at the installation portion 453 and the second casing 452 islocked onto the placement surface 490 with screws B.

The first casing 451 (optical block) is structured so as to be allowedto slide freely along the inner surface of the second casing 452 in thedirection extending along the optical axis Ax in FIG. 25, i.e., alongthe upward/downward direction. As the first casing 451 (optical block)is made to slide to the lowermost position, the lower surface 421 a ofthe metal substrate 421 achieves surface contact with the placementsurface 490. At this time, a projecting portion C at the inner surfaceof the second casing, 452 clicks into and becomes interlocked with agroove portion g1 formed at the outer surface of the first casing 451and thus, the first casing 451 becomes held by the second casing 452. Byinstalling this projector 400B on the placement surface 490 made ofmetal, the heat can be directly released to the placement surface 490from the metal substrate 421.

As the first casing 451 (optical block) in the state shown in FIG. 25slides upward, the projecting portion C having interlocked with thegroove portion g1 becomes disengaged from the groove portion g1 andclicks into and becomes interlocked with a groove portion g2 formed at aposition lower than the groove portion g1, as shown in FIG. 26. FIG. 26is a sectional view of the projector 400B with the second casing 452holding the first casing 451 so as to assure the presence of the layerof air between the metal substrate 421 and the placement surface 490.Thus, if the heat needs to be released into an air layer from the metalsubstrate 421, an air release space can be formed with ease withouthaving to use any tools.

The following operational effects can be achieved in the seventhembodiment explained above.

-   (1) The projector 400B can be placed on the placement surface 490    with an air layer formed between the metal substrate 421 at which    the LEDs 422 are mounted and the placement surface 490 (see FIG.    26). As a result, the heat can be released to the air layer reliably    without directly exposing the placement surface 490 to the heat. As    in the fifth embodiment, a compact and power efficient projector    400B is achieved.-   (2) When the heat can be directly released to the placement surface    490, the lower surface 421 a of the metal substrate 421 is allowed    to achieve surface contact with the placement surface 490 (see    FIG. 25) and, in such a case, the heat can be efficiently released    to the placement surface 490.-   (3) Since the projector 400B can be switched from the state in (1)    above to the state in (2) above and vice versa simply by sliding the    first casing 451 (optical block) along the inner surface of the    second casing 452 in the direction extending along the optical axis    Ax, the projector 400B assures ease of use.-   (4) As in the sixth embodiment, the area of the metal substrate 421    where the temperature rises to the highest level, i.e., the area    directly under the LEDs 422, is positioned within the space enclosed    by the second casing 452 and the placement surface 490 so as to    ensure that the user does not inadvertently touched the heated area    and experience discomfort.-   (5) As in the sixth embodiment, the central line (the optical axis    Ax) of the light flux emitted from the LEDs 420 is set substantially    perpendicular to the placement surface 490 and the light flux is    bent at the PBS 432 for projection. Since this assures a sufficient    height for the projection light axis, a partial eclipse of the    projection light flux at the placement surface 490 is prevented.

Another groove portion may be formed at a position further downwardrelative to the groove portion g2 at the outer surface of the firstcasing 451. This will further widen the clearance formed between themetal substrate 421 and the installation surface 492 to increase therate of heat release. By selecting the optimal groove portion to beinterlocked with the projecting portion C, the size of the clearance canbe adjusted in correspondence to the required rate of heat release.

The structure illustrated in FIG. 25 may include an elastic sheetachieving a high level of thermal conductivity inserted between thelower surface 421 a of the metal substrate 421 and the placement surface490. The elastic sheet will absorb any surface irregularities that maybe present at the placement surface 490 to assure full contact, whichwill improve the level of thermal conductivity.

Eighth Embodiment

FIG. 27 is a front view of a liquid crystal projector 400C achieved inthe eighth embodiment and FIG. 28 is a sectional view of the projectortaken along line A-A′. In FIGS. 27 and 28, the same reference numeralsare assigned to members identical to those in FIGS. 23 and 24 inreference to which the sixth embodiment has been explained to precludethe necessity for a repeated explanation thereof. As does the projectorachieved in the sixth embodiment, the projector 400C comprises a firstcasing 411 in which an optical block is housed and a second casing 412used as a seat for the first casing 411.

The structure of the optical block housed inside the first casing 411 isexplained. It differs from the optical block in the sixth embodiment inthat the light flux emitted from an LED 422 is bent at a reflectingmirror 462 (light path altering member), in that the light flux emittedfrom the LEDs 422 is guided to the reflecting mirror 462 via acondensing member 461, in the position at which the liquid crystal panel423 is disposed and in that the projection optical system is constitutedby using a refractive lens 463.

The light flux emitted from the LEDs 422 along the upward direction inFIG. 28 is condensed at the condensing member 461 and is guided to thereflecting mirror 462. The light reflected at the reflecting mirror 462then advances to the left. The condensing member 461 may be, forinstance, a Fresnel lens formed by using a resin material and has anadditional function of dividing the space inside the optical block intoseparate spaces, i.e., a space toward the LEDs 422 and a space towardthe liquid crystal panel 423.

The reflected light flux having advanced to the left is transmittedthrough the liquid crystal panel 423 and further advances to the leftbefore it is projected to the outside via the refractive lens 463 andthe aperture 435. Thus, the optical image formed at the liquid crystalpanel 423 is projected toward a screen (not shown) or the like.

In addition to operational effects similar to those of the sixthembodiment, the eighth embodiment described above achieves anotheroperational effect in that since the space inside the optical block isdivided into the space toward the LEDs 422 and the space toward theliquid crystal panel 423, the heat generated at the LEDs 422 is notreadily transferred to other members (in particular, the liquid crystalpanel 423) constituting the optical block.

While an explanation is given above in reference to the sixth througheighth embodiments on an example in which the transmission-type liquidcrystal panel 423 constitutes the optical image forming element, areflective liquid crystal (LCOS) panel maybe used instead of atransmission-type liquid crystal panel.

In addition, while an explanation is given above on an example in whichthe LEDs 422 is used as the light source in the projector, the presentinvention may also be adopted in illuminating devices other thanprojectors that use LEDs as light sources, such as an illuminatingdevice that includes an LED, a camera having an illuminating deviceconstituted with an LED and a camera having an AF auxiliary light sourceconstituted with an LED.

While an explanation is given above on an example in which the lightemitting element is an LED, the present invention may also be adopted inan illuminating device that employs an LD (a semiconductor laser).

In the sixth through eighth embodiments explained above, the lightemitting element is mounted at a metal mounting substrate, the mountingsubstrate is disposed substantially parallel to the installation surfaceon which the illuminating device is installed and the mounting substrateis covered with a casing by ensuring that at least part of the rear sideof the surface at which the light emitting element is mounted, facingopposite the installation surface, is exposed. As a result, a compactilluminating device and a compact projector device with a high level ofheat releasing performance can be provided without having to use aPeltier element or the like.

The above described embodiments are examples and various modificationscan be made without departing from the spirit and scope of theinvention.

1. A projector device to be mounted in an electronic apparatus,comprising: a first member constituted of a thermally conductivematerial, at which a light emitting device is disposed; a lightmodulating member that modulates light originating from the lightemitting device; a projection optical system that projects an imageformed with the light modulated by the light modulating member; a secondmember constituted of a material with a lower level of thermalconductivity compared to the first member, at which the first member andthe light modulating member are disposed; and a third member constitutedof a material with a high level of thermal conductivity compared to thesecond member, that supports the second member and the projectionoptical system as an integrated unit and comes into surface contact withthe first member.
 2. A projector device to be mounted in an electronicapparatus, according to claim 1, wherein: the second member is formed ina prismatic shape so as to enclose a passing light flux; and the thirdmember is bent so as to fit along an outer surface of the prism-shapedsecond member.
 3. A projector device to be mounted in an electronicapparatus according to claim 2, wherein: the first member is disposed ata position of a bottom surface of the prism-shaped second member; andthe third member comes into surface contact with the first member at theposition of the bottom surface.
 4. A projector device to be mounted inan electronic apparatus according to claim 1, wherein: the second memberholds the light modulating member at a position away from the thirdmember.
 5. A projector device to be mounted in an electronic apparatusaccording to claim 1, wherein: the third member comprises a mountingportion to be used to mount the projector device in the electronicapparatus.
 6. A projector device to be mounted in an electronicapparatus according to claim 1, further comprising: a separating portiondisposed at the second member, that separates a space toward the firstmember from a space toward the light modulating member.
 7. Anilluminating device to be mounted into an electronic apparatus, thatdirects light generated at a light emitting device to an outside,comprising: a metal substrate that comprises a mounting surface at whichthe light emitting device is mounted; and a metal heat transfer blockthat comes into surface contact with a rear side of the mounting surfacecorresponding to a mounting position of the light emitting device,wherein: a sum of a thickness of the metal substrate and a length of theheat transfer block along a direction perpendicular to the mountingsurface is greater than a distance from the mounting position of thelight emitting device to an end of the mounting surface.
 8. Anilluminating device according to claim 7, wherein: the metal substrateand the heat transfer block comes into surface contact via a thermallyconductive member.
 9. An illuminating device to be mounted into anelectronic apparatus, that directs light generated at a light emittingdevice to an outside, comprising: a metal heat transfer block thatcomprises a mounting surface at which the light emitting device ismounted, wherein: a length of the heat transfer block along a directionperpendicular to the mounting surface is greater than a distance from amounting position of the light emitting device to an end of the mountingsurface.
 10. An illuminating device according to claim 7, wherein: theheat transfer block comprises as an integrated part thereof one of apositioning portion used to determine a position of the illuminatingdevice relative to the electronic apparatus and a mounting portion usedto mount the illuminating device in the electronic apparatus.
 11. Anilluminating device according to claim 7, further comprising: an imageforming unit that receives the light from the light emitting device andforms projection light for image projection; and a projection unit thatprojects the projection light formed at the image forming unit to theoutside.
 12. An illuminating device according to claim 11, wherein: anintegrated unit is constituted by stacking the heat transfer block, thelight emitting device, the image forming unit and the projection unitalong a single direction and an optical axis of the projection lightruns along a direction perpendicular to the single direction.
 13. Anilluminating device that emits light generated at a light emittingdevice, comprising: a metal mounting substrate at which the lightemitting device is mounted; and a casing in which the mounting substratehaving the light emitting device mounted there at is housed, wherein:the mounting substrate is disposed at a metal portion of the casing soas to release heat generated at the light emitting device to an outsidevia the mounting substrate and the casing.
 14. An illuminating deviceaccording to claim 13, wherein: a rear side of the mounting substrate atwhich the light emitting device is mounted is set in complete contactwith the metal portion of the casing either directly or via a thermallyconductive member.
 15. An illuminating device according to claim 14,wherein: the metal portion coming into complete contact with themounting substrate is a bottom portion of the casing; and theilluminating device further comprises: a light path altering memberdisposed inside the casing, that bends the light radiated upward fromthe light emitting device and directs the bent light to the outsidealong a substantially horizontal direction.
 16. An illuminating devicethat emits light generated at a light emitting device, comprising: acasing that houses the light emitting device and comprises a metalportion at which the light emitting device is mounted.
 17. Anilluminating device according to claim 16, wherein: the metal portion atwhich the light emitting device is mounted is a bottom portion of thecasing; and the illuminating device further comprises: a light pathaltering member disposed inside the casing, that bends the lightradiated upward from the light emitting device and directs the bentlight to an outside along a substantially horizontal direction.
 18. Anilluminating device according to claim 15, further comprising: an imageforming unit that receives the light from the light emitting device andforms projection light for image projection; and a projection opticalsystem that projects the projection light formed at the image formingunit to the outside along a substantially horizontal direction via thelight path altering member.
 19. An illuminating device according toclaim 13, further comprising: heat radiating fins formed at an outersurface of the casing at a position corresponding to the light emittingdevice.
 20. An illuminating device that emits light generated at a lightemitting device, comprising: a metal mounting substrate to be positionedsubstantially parallel to an installation surface at which theilluminating device is installed, with the light emitting device mountedon an upper surface of the metal mounting substrate; and a casing thatcovers the mounting substrate so as to expose part of a lower surfacefacing opposite the installation surface.
 21. An illuminating deviceaccording to claim 20, wherein: the casing forms a gap between themounting substrate and the installation surface.
 22. An illuminatingdevice according to claim 21, wherein: the casing allows the gap betweenthe mounting substrate and the installation surface to be varied.
 23. Anilluminating device according to claim 21, wherein: the casing allows anangle formed by the mounting substrate and installation surface to bevaried.
 24. A projector device comprising: an illuminating deviceaccording to claim 20; an optical image forming device that forms anoptical image by modulating the light from the illuminating device; alight path altering member that alters a light path; and a projectionoptical system that projects the optical image formed by the opticalimage forming device.
 25. A projector device to be mounted in anelectronic apparatus according to claim 1, wherein: the light emittingdevice is an LED.
 26. An illuminating device according to claim 7,wherein: the light emitting device is an LED.
 27. An illuminating deviceaccording to claim 13, wherein: the light emitting device is an LED. 28.An illuminating device according to claim 20, wherein: the lightemitting device is an LED.